MCP6562T-E/MSVAO
vs
MCP6567T-E/ST
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
TSSOP, TSSOP8,.19
|
TSSOP,
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Microchip
|
|
| Amplifier Type |
COMPARATOR
|
COMPARATOR
|
| Average Bias Current-Max (IIB) |
0.005 µA
|
|
| Input Offset Voltage-Max |
10000 µV
|
10000 µV
|
| JESD-30 Code |
S-PDSO-G8
|
R-PDSO-G14
|
| JESD-609 Code |
e3
|
|
| Length |
3 mm
|
5 mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
8
|
14
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Type |
PUSH-PULL
|
OPEN-DRAIN
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
TSSOP
|
| Package Equivalence Code |
TSSOP8,.19
|
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Packing Method |
TR
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Response Time-Nom |
56 ns
|
56 ns
|
| Screening Level |
AEC-Q100
|
|
| Seated Height-Max |
1.1 mm
|
1.2 mm
|
| Supply Current-Max |
0.26 mA
|
|
| Supply Voltage Limit-Max |
6.5 V
|
6.5 V
|
| Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
3 mm
|
4.4 mm
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
TSSOP
|
| Pin Count |
|
14
|
|
|
|
Compare MCP6562T-E/MSVAO with alternatives
Compare MCP6567T-E/ST with alternatives