MCP6546UT-E/OT
vs
MCP6546T-E/SN
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
SOT-23
|
SOIC
|
Package Description |
SOT-23, 5 PIN
|
,
|
Pin Count |
5
|
8
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.33.00.01
|
Factory Lead Time |
27 Weeks, 4 Days
|
5 Weeks
|
Samacsys Manufacturer |
Microchip
|
Microchip
|
Amplifier Type |
COMPARATOR
|
COMPARATOR
|
Average Bias Current-Max (IIB) |
0.005 µA
|
0.005 µA
|
Input Offset Voltage-Max |
7000 µV
|
7000 µV
|
JESD-30 Code |
R-PDSO-G5
|
R-PDSO-G8
|
JESD-609 Code |
e3
|
e3
|
Length |
2.9 mm
|
4.9 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
5
|
8
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Type |
OPEN-DRAIN
|
OPEN-DRAIN
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LSSOP
|
SOP
|
Package Equivalence Code |
TSOP5/6,.11,37
|
SOP8,.25
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
SMALL OUTLINE
|
Packing Method |
TR
|
TR
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Response Time-Nom |
3000 ns
|
3000 ns
|
Screening Level |
TS 16949
|
TS 16949
|
Seated Height-Max |
1.45 mm
|
1.75 mm
|
Supply Current-Max |
0.001 mA
|
0.001 mA
|
Supply Voltage Limit-Max |
7 V
|
7 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
MATTE TIN
|
MATTE TIN
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.95 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
1.55 mm
|
3.9 mm
|
Base Number Matches |
1
|
1
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare MCP6546UT-E/OT with alternatives
Compare MCP6546T-E/SN with alternatives