MCP621-E/MNY vs ISL55190IBZ-T13 feature comparison

MCP621-E/MNY Microchip Technology Inc

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ISL55190IBZ-T13 Intersil Corporation

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer MICROCHIP TECHNOLOGY INC INTERSIL CORP
Part Package Code DFN SOIC
Package Description HVSON, SOP, SOP8,.25
Pin Count 8 8
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Average Bias Current-Max (IIB) 0.005 µA 40 µA
Common-mode Reject Ratio-Nom 81 dB 95 dB
Input Offset Voltage-Max 200 µV 500 µV
JESD-30 Code R-PDSO-N8 R-PDSO-G8
JESD-609 Code e4 e3
Length 3 mm 4.9022 mm
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVSON SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.8 mm 1.7272 mm
Slew Rate-Nom 10 V/us 268 V/us
Supply Voltage Limit-Max 6.5 V 5.5 V
Supply Voltage-Nom (Vsup) 2.5 V 5 V
Surface Mount YES YES
Technology CMOS BICMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish NICKEL PALLADIUM GOLD MATTE TIN
Terminal Form NO LEAD GULL WING
Terminal Pitch 0.5 mm 1.27 mm
Terminal Position DUAL DUAL
Unity Gain BW-Nom 20000 800000
Width 2 mm 3.9116 mm
Base Number Matches 1 2
Rohs Code Yes
Architecture VOLTAGE-FEEDBACK
Bias Current-Max (IIB) @25C 25 µA
Frequency Compensation YES
Low-Bias NO
Low-Offset YES
Micropower NO
Moisture Sensitivity Level 3
Package Equivalence Code SOP8,.25
Packing Method TAPE AND REEL
Peak Reflow Temperature (Cel) 260
Power NO
Programmable Power NO
Slew Rate-Min 163 V/us
Supply Current-Max 20 mA
Time@Peak Reflow Temperature-Max (s) 30
Voltage Gain-Min 17780
Wideband YES

Compare MCP621-E/MNY with alternatives

Compare ISL55190IBZ-T13 with alternatives