MCP6144-E/P
vs
MCP6144-E/SL
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Part Package Code
DIP
SOIC
Package Description
DIP, DIP14,.3
SOP, SOP14,.25
Pin Count
14
14
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Factory Lead Time
15 Weeks
15 Weeks
Samacsys Manufacturer
Microchip
Microchip
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Architecture
VOLTAGE-FEEDBACK
VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB)
0.005 µA
0.005 µA
Common-mode Reject Ratio-Min
62 dB
62 dB
Common-mode Reject Ratio-Nom
80 dB
80 dB
Frequency Compensation
YES
YES
Input Offset Voltage-Max
3000 µV
3000 µV
JESD-30 Code
R-PDIP-T14
R-PDSO-G14
JESD-609 Code
e3
e3
Length
19.05 mm
8.65 mm
Low-Bias
YES
YES
Low-Offset
NO
NO
Micropower
YES
YES
Number of Functions
4
4
Number of Terminals
14
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Equivalence Code
DIP14,.3
SOP14,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Packing Method
TUBE
TUBE
Power
NO
NO
Programmable Power
NO
NO
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.334 mm
1.75 mm
Slew Rate-Nom
24000 V/us
24000 V/us
Supply Current-Max
0.004 mA
0.004 mA
Supply Voltage Limit-Max
7 V
7 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
MATTE TIN
Matte Tin (Sn)
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Unity Gain BW-Nom
100
100
Voltage Gain-Min
56200
56200
Wideband
NO
NO
Width
7.62 mm
3.9 mm
Base Number Matches
1
1
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
40
Compare MCP6144-E/P with alternatives
Compare MCP6144-E/SL with alternatives