MCP608-I/P vs MCP606I/P feature comparison

MCP608-I/P Microchip Technology Inc

Buy Now Datasheet

MCP606I/P Microchip Technology Inc

Buy Now Datasheet
Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Part Package Code DIP DIP
Package Description DIP, DIP8,.3 DIP,
Pin Count 8 8
Reach Compliance Code compliant compliant
ECCN Code EAR99
HTS Code 8542.33.00.01
Factory Lead Time 6 Weeks
Samacsys Manufacturer Microchip
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB) 0.00008 µA 0.00008 µA
Common-mode Reject Ratio-Min 75 dB
Common-mode Reject Ratio-Nom 91 dB 91 dB
Frequency Compensation YES
Input Offset Voltage-Max 250 µV 250 µV
JESD-30 Code R-PDIP-T8 R-PDIP-T8
JESD-609 Code e3 e3
Length 9.27 mm 9.27 mm
Low-Bias YES
Low-Offset YES
Micropower YES
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Packing Method TUBE
Power NO
Programmable Power NO
Qualification Status Not Qualified Not Qualified
Screening Level TS 16949
Seated Height-Max 5.33 mm 5.33 mm
Slew Rate-Nom 0.08 V/us 0.08 V/us
Supply Current-Max 0.025 mA
Supply Voltage Limit-Max 7 V 7 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish MATTE TIN MATTE TIN
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Unity Gain BW-Nom 155 155
Voltage Gain-Min 100000
Wideband NO
Width 7.62 mm 7.62 mm
Base Number Matches 2 2
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare MCP608-I/P with alternatives

Compare MCP606I/P with alternatives