MCP6024-E/SL
vs
MCP6024T-I/P
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Part Package Code
SOIC
DIP
Pin Count
14
14
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Factory Lead Time
5 Weeks
Samacsys Manufacturer
Microchip
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Architecture
VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB)
0.005 µA
0.00015 µA
Common-mode Reject Ratio-Min
74 dB
Common-mode Reject Ratio-Nom
90 dB
90 dB
Frequency Compensation
YES
Input Offset Voltage-Max
2500 µV
500 µV
JESD-30 Code
R-PDSO-G14
R-PDIP-T14
JESD-609 Code
e3
e3
Length
8.65 mm
19.05 mm
Low-Bias
YES
Low-Offset
NO
Micropower
NO
Moisture Sensitivity Level
1
Number of Functions
4
4
Number of Terminals
14
14
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
DIP
Package Equivalence Code
SOP14,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Packing Method
TUBE
Peak Reflow Temperature (Cel)
260
Power
NO
Programmable Power
NO
Qualification Status
Not Qualified
Not Qualified
Screening Level
TS 16949
Seated Height-Max
1.75 mm
4.32 mm
Slew Rate-Nom
7 V/us
7 V/us
Supply Current-Max
5.4 mA
Supply Voltage Limit-Max
7 V
7 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
MATTE TIN
MATTE TIN
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Unity Gain BW-Nom
10000
10000
Voltage Gain-Min
31620
Wideband
NO
Width
3.9 mm
7.62 mm
Base Number Matches
1
1
Package Description
DIP,
Compare MCP6024-E/SL with alternatives
Compare MCP6024T-I/P with alternatives