MCP6022-I/SL vs MCP6022-I/PREL feature comparison

MCP6022-I/SL Microchip Technology Inc

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MCP6022-I/PREL Microchip Technology Inc

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Part Life Cycle Code Active Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Package Description SOP, DIP, DIP8,.3
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Average Bias Current-Max (IIB) 0.00015 µA 0.00015 µA
Common-mode Reject Ratio-Nom 90 dB 90 dB
Input Offset Voltage-Max 500 µV 500 µV
JESD-30 Code R-PDSO-G14 R-PDIP-T8
Length 8.65 mm 9.46 mm
Number of Functions 2 2
Number of Terminals 14 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Seated Height-Max 1.75 mm 4.32 mm
Slew Rate-Nom 7 V/us 7 V/us
Supply Voltage Limit-Max 7 V 7 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Unity Gain BW-Nom 10000 10000
Width 3.9 mm 7.62 mm
Base Number Matches 1 1
Pbfree Code No
Rohs Code Yes
Part Package Code DIP
Pin Count 8
Architecture VOLTAGE-FEEDBACK
Common-mode Reject Ratio-Min 74 dB
Frequency Compensation YES
JESD-609 Code e3
Low-Bias YES
Low-Offset YES
Micropower NO
Package Equivalence Code DIP8,.3
Packing Method TUBE
Power NO
Programmable Power NO
Qualification Status Not Qualified
Supply Current-Max 2.7 mA
Terminal Finish MATTE TIN
Voltage Gain-Min 31620
Wideband NO

Compare MCP6022-I/SL with alternatives

Compare MCP6022-I/PREL with alternatives