MCP6022-I/SL vs MCP6022-E/SN feature comparison

MCP6022-I/SL Microchip Technology Inc

Buy Now Datasheet

MCP6022-E/SN Microchip Technology Inc

Buy Now Datasheet
Part Life Cycle Code Active Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Package Description SOP,
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Average Bias Current-Max (IIB) 0.00015 µA 0.005 µA
Common-mode Reject Ratio-Nom 90 dB 90 dB
Input Offset Voltage-Max 500 µV 2500 µV
JESD-30 Code R-PDSO-G14 R-PDSO-G8
Length 8.65 mm 4.9 mm
Number of Functions 2 2
Number of Terminals 14 8
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Seated Height-Max 1.75 mm 1.75 mm
Slew Rate-Nom 7 V/us 7 V/us
Supply Voltage Limit-Max 7 V 7 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Unity Gain BW-Nom 10000 10000
Width 3.9 mm 3.91 mm
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
Part Package Code SOIC
Pin Count 8
Factory Lead Time 4 Weeks
Samacsys Manufacturer Microchip
Architecture VOLTAGE-FEEDBACK
Common-mode Reject Ratio-Min 74 dB
Frequency Compensation YES
JESD-609 Code e3
Low-Bias YES
Low-Offset NO
Micropower NO
Moisture Sensitivity Level 1
Package Equivalence Code SOP8,.25
Packing Method TUBE
Peak Reflow Temperature (Cel) 260
Power NO
Programmable Power NO
Qualification Status Not Qualified
Screening Level TS 16949
Supply Current-Max 2.7 mA
Terminal Finish MATTE TIN
Time@Peak Reflow Temperature-Max (s) 30
Voltage Gain-Min 31620
Wideband NO

Compare MCP6022-I/SL with alternatives

Compare MCP6022-E/SN with alternatives