MCP602-E/SN vs MCP602T-I/SL feature comparison

MCP602-E/SN Microchip Technology Inc

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MCP602T-I/SL Telcom Semiconductor Inc

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer MICROCHIP TECHNOLOGY INC TELCOM SEMICONDUCTOR INC
Part Package Code SOIC
Pin Count 8
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.33.00.01
Factory Lead Time 5 Weeks
Samacsys Manufacturer Microchip
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB) 0.005 µA
Common-mode Reject Ratio-Min 75 dB
Common-mode Reject Ratio-Nom 90 dB 90 dB
Frequency Compensation YES
Input Offset Voltage-Max 4500 µV 2000 µV
JESD-30 Code R-PDSO-G8 R-PDSO-G14
JESD-609 Code e3
Length 4.9 mm
Low-Bias YES
Low-Offset NO
Micropower YES
Moisture Sensitivity Level 1
Number of Functions 2 2
Number of Terminals 8 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP
Package Equivalence Code SOP8,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Packing Method TUBE
Peak Reflow Temperature (Cel) 260
Power NO
Programmable Power NO
Qualification Status Not Qualified Not Qualified
Screening Level TS 16949
Seated Height-Max 1.75 mm
Slew Rate-Nom 2.3 V/us 2.3 V/us
Supply Current-Max 0.65 mA
Supply Voltage Limit-Max 7 V 7 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Unity Gain BW-Nom 2800 2800
Voltage Gain-Min 56200
Wideband NO
Width 3.91 mm
Base Number Matches 2 1
Package Description ,

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