MCP602T-I/SL
vs
MCP602T-E/STVAO
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
TELCOM SEMICONDUCTOR INC
MICROCHIP TECHNOLOGY INC
Package Description
,
TSSOP,
Reach Compliance Code
unknown
compliant
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Common-mode Reject Ratio-Nom
90 dB
90 dB
Input Offset Voltage-Max
2000 µV
4500 µV
JESD-30 Code
R-PDSO-G14
R-PDSO-G8
Number of Functions
2
2
Number of Terminals
14
8
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Qualification Status
Not Qualified
Slew Rate-Nom
2.3 V/us
2.3 V/us
Supply Voltage Limit-Max
7 V
7 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Form
GULL WING
GULL WING
Terminal Position
DUAL
DUAL
Unity Gain BW-Nom
2800
2800
Base Number Matches
1
1
ECCN Code
EAR99
HTS Code
8542.33.00.01
Samacsys Manufacturer
Microchip
Architecture
VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB)
0.005 µA
Common-mode Reject Ratio-Min
75 dB
Frequency Compensation
YES
JESD-609 Code
e3
Length
4.4 mm
Low-Bias
YES
Low-Offset
NO
Micropower
YES
Package Code
TSSOP
Package Equivalence Code
TSSOP8,.25
Packing Method
TR
Power
NO
Programmable Power
NO
Screening Level
AEC-Q100; TS 16949
Seated Height-Max
1.1 mm
Supply Current-Max
0.65 mA
Terminal Finish
MATTE TIN
Terminal Pitch
0.65 mm
Voltage Gain-Min
56200
Wideband
NO
Width
3 mm
Compare MCP602T-I/SL with alternatives
Compare MCP602T-E/STVAO with alternatives