MCP4716A0T-E/MAY
vs
MCP4716A4T-E/MA
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
HVSON,
|
HVSON, SOLCC6,.08,25
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
4 Weeks
|
|
Samacsys Manufacturer |
Microchip
|
|
Analog Output Voltage-Max |
5.46 V
|
|
Analog Output Voltage-Min |
0.01 V
|
|
Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
Input Bit Code |
BINARY
|
BINARY
|
Input Format |
SERIAL
|
SERIAL
|
JESD-30 Code |
S-PDSO-N6
|
S-PDSO-N6
|
JESD-609 Code |
e4
|
|
Length |
2 mm
|
2 mm
|
Linearity Error-Max (EL) |
0.354%
|
0.354%
|
Moisture Sensitivity Level |
1
|
|
Number of Bits |
10
|
10
|
Number of Functions |
1
|
1
|
Number of Terminals |
6
|
6
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVSON
|
HVSON
|
Package Equivalence Code |
TSSOP6,.08
|
SOLCC6,.08,25
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
|
Screening Level |
TS 16949
|
|
Seated Height-Max |
0.9 mm
|
0.9 mm
|
Settling Time-Nom (tstl) |
6 µs
|
6 µs
|
Supply Current-Max |
0.4 mA
|
0.4 mA
|
Supply Voltage-Nom |
3 V
|
5.5 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Width |
2 mm
|
2 mm
|
Base Number Matches |
1
|
1
|
Part Package Code |
|
DFN
|
Pin Count |
|
6
|
Qualification Status |
|
Not Qualified
|
Technology |
|
BIPOLAR
|
|
|
|
Compare MCP4716A0T-E/MAY with alternatives
Compare MCP4716A4T-E/MA with alternatives