MCP2562FDT-H/MF
vs
TJF1051T/3/CM,118
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Not Recommended
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
NXP SEMICONDUCTORS
Package Description
DFN-8
SOP, SOP8,.25
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
Factory Lead Time
6 Weeks
10 Weeks
Samacsys Manufacturer
Microchip
NXP
Data Rate
8000 Mbps
1000 Mbps
JESD-30 Code
S-PDSO-N8
R-PDSO-G8
JESD-609 Code
e3
Length
3 mm
4.9 mm
Moisture Sensitivity Level
1
1
Number of Functions
1
1
Number of Terminals
8
8
Number of Transceivers
1
1
Operating Temperature-Max
150 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVSON
SOP
Package Equivalence Code
SOLCC8,.12,25
SOP8,.25
Package Shape
SQUARE
RECTANGULAR
Package Style
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
260
Screening Level
TS 16949
Seated Height-Max
1 mm
1.75 mm
Supply Current-Max
70 mA
70 mA
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Telecom IC Type
CAN FD TRANSCEIVER
SUPPORT CIRCUIT
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
MATTE TIN
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
0.65 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
40
30
Width
3 mm
3.9 mm
Base Number Matches
1
1
Part Package Code
SOIC
Pin Count
8
Manufacturer Package Code
SOT96-1
Qualification Status
Not Qualified
Compare MCP2562FDT-H/MF with alternatives
Compare TJF1051T/3/CM,118 with alternatives