MCP2561FDT-H/MF
vs
MCP2561FD-H/MF
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Yes
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Package Description
DFN-8
DFN-8
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8529.90.22.00
8529.90.22.00
Factory Lead Time
4 Weeks
6 Weeks
Samacsys Manufacturer
Microchip
Microchip
Data Rate
8000 Mbps
8000 Mbps
JESD-30 Code
S-PDSO-N8
S-PDSO-N8
JESD-609 Code
e3
e3
Length
3 mm
3 mm
Moisture Sensitivity Level
1
1
Number of Functions
1
1
Number of Terminals
8
8
Number of Transceivers
1
1
Operating Temperature-Max
150 °C
150 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVSON
HVSON
Package Equivalence Code
SOLCC8,.12,25
SOLCC8,.12,25
Package Shape
SQUARE
SQUARE
Package Style
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel)
260
260
Screening Level
TS 16949
TS 16949
Seated Height-Max
1 mm
1 mm
Supply Current-Max
70 mA
70 mA
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Telecom IC Type
CAN FD TRANSCEIVER
CAN FD TRANSCEIVER
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
MATTE TIN
MATTE TIN
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
40
40
Width
3 mm
3 mm
Base Number Matches
1
1
Compare MCP2561FDT-H/MF with alternatives
Compare MCP2561FD-H/MF with alternatives