MCP23S17T-E/MLVAO
vs
MCP23S18-E/SO
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
QFN-28
|
SOIC-28
|
Reach Compliance Code |
compliant
|
compliant
|
Clock Frequency-Max |
10 MHz
|
10 MHz
|
External Data Bus Width |
|
|
JESD-30 Code |
S-PQCC-N28
|
R-PDSO-G28
|
JESD-609 Code |
e3
|
e3
|
Length |
6 mm
|
17.9 mm
|
Number of Bits |
16
|
16
|
Number of I/O Lines |
16
|
16
|
Number of Ports |
2
|
2
|
Number of Terminals |
28
|
28
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
SOP
|
Package Equivalence Code |
LCC28,.24SQ,25
|
SOP28,.4
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE
|
Screening Level |
AEC-Q100
|
|
Seated Height-Max |
1 mm
|
2.65 mm
|
Supply Current-Max |
1 mA
|
1 mA
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
4.5 V
|
1.8 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
Matte Tin (Sn)
|
MATTE TIN
|
Terminal Form |
NO LEAD
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
DUAL
|
Width |
6 mm
|
7.5 mm
|
uPs/uCs/Peripheral ICs Type |
PARALLEL IO PORT, GENERAL PURPOSE
|
PARALLEL IO PORT, GENERAL PURPOSE
|
Base Number Matches |
1
|
1
|
Part Package Code |
|
SOIC
|
Pin Count |
|
28
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8542.39.00.01
|
Factory Lead Time |
|
7 Weeks
|
Samacsys Manufacturer |
|
Microchip
|
Moisture Sensitivity Level |
|
1
|
Peak Reflow Temperature (Cel) |
|
260
|
Qualification Status |
|
Not Qualified
|
|
|
|
Compare MCP23S17T-E/MLVAO with alternatives
Compare MCP23S18-E/SO with alternatives