MCP23S08-E/SS
vs
MCP23S09-E/P
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Yes
Rohs Code
Yes
Yes
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Part Package Code
SSOP
DIP
Package Description
SSOP-20
0.300 INCH, LEAD FREE, PLASTIC, DIP-18
Pin Count
20
18
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
Microchip
Microchip
Clock Frequency-Max
10 MHz
10 MHz
External Data Bus Width
JESD-30 Code
R-PDSO-G20
R-XDIP-T18
JESD-609 Code
e3
e3
Length
7.2 mm
22.86 mm
Moisture Sensitivity Level
1
Number of Bits
8
8
Number of I/O Lines
8
8
Number of Ports
1
1
Number of Terminals
20
18
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
SSOP
DIP
Package Equivalence Code
SSOP20,.3
DIP18,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, SHRINK PITCH
IN-LINE
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2 mm
5.334 mm
Supply Current-Max
1 mA
1 mA
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
1.8 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
Matte Tin (Sn)
MATTE TIN
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
0.65 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
40
Width
5.3 mm
7.62 mm
uPs/uCs/Peripheral ICs Type
PARALLEL IO PORT, GENERAL PURPOSE
PARALLEL IO PORT, GENERAL PURPOSE
Base Number Matches
1
1
Factory Lead Time
6 Weeks
Compare MCP23S08-E/SS with alternatives
Compare MCP23S09-E/P with alternatives