MCP23S08-E/P
vs
MCP23009T-E/SS
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Part Package Code
DIP
SSOP
Package Description
DIP-18
5.30 MM, LEAD FREE, PLASTIC, SSOP-20
Pin Count
18
20
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
6 Weeks
9 Weeks
Samacsys Manufacturer
Microchip
Microchip
Clock Frequency-Max
10 MHz
10 MHz
External Data Bus Width
JESD-30 Code
R-PDIP-T18
R-PDSO-G20
JESD-609 Code
e3
e3
Length
22.86 mm
7.2 mm
Number of Bits
8
8
Number of I/O Lines
8
8
Number of Ports
1
8
Number of Terminals
18
20
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
SSOP
Package Equivalence Code
DIP18,.3
SSOP20,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE, SHRINK PITCH
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
2 mm
Supply Current-Max
1 mA
1 mA
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
1.8 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
MATTE TIN
Matte Tin (Sn) - annealed
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
0.65 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
5.3 mm
uPs/uCs/Peripheral ICs Type
PARALLEL IO PORT, GENERAL PURPOSE
PARALLEL IO PORT, GENERAL PURPOSE
Base Number Matches
1
1
Moisture Sensitivity Level
2
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
40
Compare MCP23S08-E/P with alternatives
Compare MCP23009T-E/SS with alternatives