MCP23S08-E/P
vs
MCP23008-E/SS
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
DIP
|
SSOP
|
| Package Description |
DIP-18
|
SSOP-20
|
| Pin Count |
18
|
20
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
6 Weeks
|
6 Weeks
|
| Samacsys Manufacturer |
Microchip
|
Microchip
|
| Clock Frequency-Max |
10 MHz
|
10 MHz
|
| External Data Bus Width |
|
|
| JESD-30 Code |
R-PDIP-T18
|
R-PDSO-G20
|
| JESD-609 Code |
e3
|
e3
|
| Length |
22.86 mm
|
7.2 mm
|
| Number of Bits |
8
|
8
|
| Number of I/O Lines |
8
|
8
|
| Number of Ports |
1
|
8
|
| Number of Terminals |
18
|
20
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SSOP
|
| Package Equivalence Code |
DIP18,.3
|
SSOP20,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE, SHRINK PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
2 mm
|
| Supply Current-Max |
1 mA
|
1 mA
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
5.3 mm
|
| uPs/uCs/Peripheral ICs Type |
PARALLEL IO PORT, GENERAL PURPOSE
|
PARALLEL IO PORT, GENERAL PURPOSE
|
| Base Number Matches |
1
|
1
|
| Moisture Sensitivity Level |
|
2
|
| Peak Reflow Temperature (Cel) |
|
260
|
|
|
|
Compare MCP23S08-E/P with alternatives
Compare MCP23008-E/SS with alternatives