MCP2221AT-I/ML
vs
MCP14A1201-E/MNY
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
QFN-16
|
TDFN-8
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Date Of Intro |
2016-06-15
|
2019-07-11
|
| Samacsys Manufacturer |
Microchip
|
|
| Bus Compatibility |
I2C; SMBUS; UART; USB
|
|
| Clock Frequency-Max |
12 MHz
|
|
| Data Transfer Rate-Max |
1.5 MBps
|
|
| JESD-30 Code |
S-PQCC-N16
|
R-PDSO-N8
|
| JESD-609 Code |
e3
|
|
| Length |
4 mm
|
3 mm
|
| Number of Terminals |
16
|
8
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
HVSON
|
| Package Equivalence Code |
LCC16,.16SQ,25
|
SOLCC8,.12,20
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Seated Height-Max |
1 mm
|
0.8 mm
|
| Supply Current-Max |
15 mA
|
0.6 mA
|
| Supply Voltage-Max |
5.5 V
|
18 V
|
| Supply Voltage-Min |
3 V
|
4.5 V
|
| Supply Voltage-Nom |
3.3 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.65 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Width |
4 mm
|
2 mm
|
| uPs/uCs/Peripheral ICs Type |
BUS CONTROLLER, UNIVERSAL SERIAL BUS
|
|
| Base Number Matches |
1
|
1
|
| High Side Driver |
|
NO
|
| Interface IC Type |
|
BUFFER OR INVERTER BASED MOSFET DRIVER
|
| Number of Functions |
|
2
|
| Output Peak Current Limit-Nom |
|
12 A
|
| Turn-off Time |
|
0.037 µs
|
| Turn-on Time |
|
0.037 µs
|
|
|
|
Compare MCP2221AT-I/ML with alternatives
Compare MCP14A1201-E/MNY with alternatives