MCP2022A-330E/P
vs
NCN5130MNTWG
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Not Recommended
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
ONSEMI
Package Description
DIP,
QFN-40
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-PDIP-T8
S-XQCC-N40
JESD-609 Code
e3
e3
Length
9.271 mm
6 mm
Number of Functions
1
1
Number of Terminals
8
40
Operating Temperature-Max
125 °C
105 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
DIP
HVQCCN
Package Shape
RECTANGULAR
SQUARE
Package Style
IN-LINE
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Screening Level
TS 16949
Seated Height-Max
5.334 mm
1 mm
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
NO
YES
Telecom IC Type
CAN TRANSCEIVER
INTERFACE CIRCUIT
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
MATTE TIN
MATTE TIN
Terminal Form
THROUGH-HOLE
NO LEAD
Terminal Pitch
2.54 mm
0.5 mm
Terminal Position
DUAL
QUAD
Width
7.62 mm
6 mm
Base Number Matches
1
1
Pbfree Code
Part Package Code
QFN-40
Manufacturer Package Code
485AU
Factory Lead Time
71 Weeks
Samacsys Manufacturer
onsemi
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
30
Compare MCP2022A-330E/P with alternatives
Compare NCN5130MNTWG with alternatives