MCP2022A-330E/P
vs
LU82562V
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Not Recommended
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
INTEL CORP
Package Description
DIP,
BGA,
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-PDIP-T8
S-PBGA-B81
JESD-609 Code
e3
e1
Length
9.271 mm
10 mm
Number of Functions
1
1
Number of Terminals
8
81
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
BGA
Package Shape
RECTANGULAR
SQUARE
Package Style
IN-LINE
GRID ARRAY
Screening Level
TS 16949
Seated Height-Max
5.334 mm
1.815 mm
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
NO
YES
Telecom IC Type
CAN TRANSCEIVER
INTERFACE CIRCUIT
Temperature Grade
AUTOMOTIVE
OTHER
Terminal Finish
MATTE TIN
TIN SILVER COPPER
Terminal Form
THROUGH-HOLE
BALL
Terminal Pitch
2.54 mm
1 mm
Terminal Position
DUAL
BOTTOM
Width
7.62 mm
10 mm
Base Number Matches
1
1
Pbfree Code
Part Package Code
BGA
Pin Count
81
Qualification Status
Not Qualified
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