MCP2021P-330E/SN
vs
BD41030HFN-CGTR
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Not Recommended
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
ROHM CO LTD
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Microchip
|
ROHM Semiconductor
|
JESD-30 Code |
R-PDSO-G8
|
R-PDSO-N8
|
JESD-609 Code |
e3
|
|
Length |
4.9 mm
|
2.9 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
8
|
Number of Transceivers |
1
|
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
HVSON
|
Package Equivalence Code |
SOP8,.25
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
Screening Level |
TS 16949
|
AEC-Q100
|
Seated Height-Max |
1.75 mm
|
0.6 mm
|
Supply Voltage-Nom |
12 V
|
12 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
LIN TRANSCEIVER
|
LIN TRANSCEIVER
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
MATTE TIN
|
|
Terminal Form |
GULL WING
|
NO LEAD
|
Terminal Pitch |
1.27 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
3.9 mm
|
2.8 mm
|
Base Number Matches |
1
|
1
|
Package Description |
|
HVSON,
|
Factory Lead Time |
|
18 Weeks
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare MCP2021P-330E/SN with alternatives
Compare BD41030HFN-CGTR with alternatives