MCP2021-330E/SN
vs
MCP2021-330E/P
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Part Package Code
SOIC
DIP
Package Description
3.90 MM, LEAD FREE, PLASTIC, SOIC-8
0.300 INCH, LEAD FREE, PLASTIC, DIP-8
Pin Count
8
8
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
Microchip
Microchip
JESD-30 Code
R-PDSO-G8
R-PDIP-T8
JESD-609 Code
e3
e3
Length
4.9 mm
9.271 mm
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Terminals
8
8
Number of Transceivers
1
1
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
DIP
Package Equivalence Code
SOP8,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Peak Reflow Temperature (Cel)
260
Screening Level
TS 16949
TS 16949
Seated Height-Max
1.75 mm
5.334 mm
Supply Voltage-Nom
12 V
12 V
Surface Mount
YES
NO
Telecom IC Type
LIN TRANSCEIVER
LIN TRANSCEIVER
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
Matte Tin (Sn)
MATTE TIN
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
3.9 mm
7.62 mm
Base Number Matches
1
1
Compare MCP2021-330E/SN with alternatives
Compare MCP2021-330E/P with alternatives