MCP2021-330E/P
vs
MCP2021T-E/SN
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Part Package Code
DIP
SOIC
Package Description
0.300 INCH, LEAD FREE, PLASTIC, DIP-8
3.90 MM, LEAD FREE, PLASTIC, SOIC-8
Pin Count
8
8
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
Microchip
JESD-30 Code
R-PDIP-T8
R-PDSO-G8
JESD-609 Code
e3
e3
Length
9.271 mm
4.9 mm
Number of Functions
1
1
Number of Terminals
8
8
Number of Transceivers
1
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Screening Level
TS 16949
Seated Height-Max
5.334 mm
1.75 mm
Supply Voltage-Nom
12 V
12 V
Surface Mount
NO
YES
Telecom IC Type
LIN TRANSCEIVER
INTERFACE CIRCUIT
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
MATTE TIN
MATTE TIN
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
3.9 mm
Base Number Matches
1
1
Pbfree Code
Moisture Sensitivity Level
1
Qualification Status
Not Qualified
Compare MCP2021-330E/P with alternatives
Compare MCP2021T-E/SN with alternatives