MCP2021-330E/P vs MCP2021T-E/SN feature comparison

MCP2021-330E/P Microchip Technology Inc

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MCP2021T-E/SN Microchip Technology Inc

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Part Package Code DIP SOIC
Package Description 0.300 INCH, LEAD FREE, PLASTIC, DIP-8 3.90 MM, LEAD FREE, PLASTIC, SOIC-8
Pin Count 8 8
Reach Compliance Code compliant compliant
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Microchip
JESD-30 Code R-PDIP-T8 R-PDSO-G8
JESD-609 Code e3 e3
Length 9.271 mm 4.9 mm
Number of Functions 1 1
Number of Terminals 8 8
Number of Transceivers 1
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Screening Level TS 16949
Seated Height-Max 5.334 mm 1.75 mm
Supply Voltage-Nom 12 V 12 V
Surface Mount NO YES
Telecom IC Type LIN TRANSCEIVER INTERFACE CIRCUIT
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish MATTE TIN MATTE TIN
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.62 mm 3.9 mm
Base Number Matches 1 1
Pbfree Code Yes
Moisture Sensitivity Level 1
Qualification Status Not Qualified

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