MCP2021-330E/P
vs
MCP2021AT-330E/MDVAO
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Part Package Code
DIP
Package Description
0.300 INCH, LEAD FREE, PLASTIC, DIP-8
DFN-8
Pin Count
8
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
Microchip
JESD-30 Code
R-PDIP-T8
S-PDSO-N8
JESD-609 Code
e3
Length
9.271 mm
4 mm
Number of Functions
1
1
Number of Terminals
8
8
Number of Transceivers
1
1
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
HVSON
Package Shape
RECTANGULAR
SQUARE
Package Style
IN-LINE
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Screening Level
TS 16949
AEC-Q100; TS 16949
Seated Height-Max
5.334 mm
1 mm
Supply Voltage-Nom
12 V
12 V
Surface Mount
NO
YES
Telecom IC Type
LIN TRANSCEIVER
LIN TRANSCEIVER
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
MATTE TIN
Terminal Form
THROUGH-HOLE
NO LEAD
Terminal Pitch
2.54 mm
0.8 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
4 mm
Base Number Matches
1
1
Package Equivalence Code
SOLCC8,.16,32
Compare MCP2021-330E/P with alternatives
Compare MCP2021AT-330E/MDVAO with alternatives