MCP2021-330E/MD-AE2VAO vs MCP2021AT-330E/SN feature comparison

MCP2021-330E/MD-AE2VAO Microchip Technology Inc

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MCP2021AT-330E/SN Microchip Technology Inc

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Part Life Cycle Code Obsolete Not Recommended
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Package Description DFN-8 SOIC-8
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PDSO-N8 R-PDSO-G8
Length 4 mm 4.9 mm
Number of Functions 1 1
Number of Terminals 8 8
Number of Transceivers 1 1
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVSON SOP
Package Equivalence Code SOLCC8,.16,32 SOP8,.25
Package Shape SQUARE RECTANGULAR
Package Style SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE
Screening Level AEC-Q100; TS 16949 TS 16949
Seated Height-Max 1 mm 1.75 mm
Supply Voltage-Nom 12 V 12 V
Surface Mount YES YES
Telecom IC Type LIN TRANSCEIVER CAN TRANSCEIVER
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Form NO LEAD GULL WING
Terminal Pitch 0.8 mm 1.27 mm
Terminal Position DUAL DUAL
Width 4 mm 3.9 mm
Base Number Matches 1 1
Rohs Code Yes
ECCN Code EAR99
Factory Lead Time 6 Weeks
Samacsys Manufacturer Microchip
JESD-609 Code e3
Terminal Finish MATTE TIN

Compare MCP2021-330E/MD-AE2VAO with alternatives

Compare MCP2021AT-330E/SN with alternatives