MCP2021-330E/MD-AE2VAO vs MCP2021P-E/P feature comparison

MCP2021-330E/MD-AE2VAO Microchip Technology Inc

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MCP2021P-E/P Microchip Technology Inc

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Package Description DFN-8 DIP-8
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PDSO-N8 R-PDIP-T8
Length 4 mm 9.271 mm
Number of Functions 1 1
Number of Terminals 8 8
Number of Transceivers 1
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVSON DIP
Package Equivalence Code SOLCC8,.16,32
Package Shape SQUARE RECTANGULAR
Package Style SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE IN-LINE
Screening Level AEC-Q100; TS 16949 TS 16949
Seated Height-Max 1 mm 5.334 mm
Supply Voltage-Nom 12 V 12 V
Surface Mount YES NO
Telecom IC Type LIN TRANSCEIVER INTERFACE CIRCUIT
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Form NO LEAD THROUGH-HOLE
Terminal Pitch 0.8 mm 2.54 mm
Terminal Position DUAL DUAL
Width 4 mm 7.62 mm
Base Number Matches 1 1

Compare MCP2021-330E/MD-AE2VAO with alternatives

Compare MCP2021P-E/P with alternatives