MCP201-E/P
vs
TJA1022TK
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP,
|
HVSON,
|
| Pin Count |
8
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Microchip
|
NXP
|
| JESD-30 Code |
R-PDIP-T8
|
R-PDSO-N14
|
| JESD-609 Code |
e3
|
|
| Length |
9.271 mm
|
4.5 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
14
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
HVSON
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
5.334 mm
|
1 mm
|
| Supply Voltage-Nom |
12 V
|
12 V
|
| Surface Mount |
NO
|
YES
|
| Telecom IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
| Temperature Grade |
AUTOMOTIVE
|
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
| Terminal Pitch |
2.54 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
3 mm
|
| Base Number Matches |
1
|
1
|
| Moisture Sensitivity Level |
|
1
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Screening Level |
|
AEC-Q100
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare MCP201-E/P with alternatives
Compare TJA1022TK with alternatives