MCP1811ATT-012/5X
vs
MCP1811ATT-012/OT
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
QFN-4
|
SOT-23, 5 PIN
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Date Of Intro |
2018-09-27
|
2018-09-27
|
| Dropout Voltage1-Max |
0.6 V
|
0.6 V
|
| Dropout Voltage1-Nom |
0.4 V
|
0.4 V
|
| Input Voltage-Max |
5.5 V
|
5.5 V
|
| Input Voltage-Min |
1.8 V
|
1.8 V
|
| JESD-30 Code |
S-PDSO-N4
|
R-PDSO-G5
|
| JESD-609 Code |
e3
|
e3
|
| Length |
1 mm
|
2.9 mm
|
| Load Regulation-Max |
0.025%
|
0.025%
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
4
|
5
|
| Operating Temperature TJ-Max |
85 °C
|
85 °C
|
| Operating Temperature TJ-Min |
-40 °C
|
-40 °C
|
| Output Current1-Max |
0.15 A
|
0.15 A
|
| Output Voltage1-Max |
1.248 V
|
1.248 V
|
| Output Voltage1-Min |
1.152 V
|
1.152 V
|
| Output Voltage1-Nom |
1.2 V
|
1.2 V
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HTSON
|
LSSOP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE
|
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Regulator Type |
FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
|
FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
|
| Screening Level |
TS 16949
|
TS 16949
|
| Seated Height-Max |
0.6 mm
|
1.45 mm
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Finish |
Matte Tin (Sn)
|
Matte Tin (Sn)
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Voltage Tolerance-Max |
4%
|
4%
|
| Width |
1 mm
|
1.6 mm
|
| Base Number Matches |
1
|
1
|
| Package Equivalence Code |
|
TSOP5,.11,37
|
| Terminal Pitch |
|
0.95 mm
|
|
|
|
Compare MCP1811ATT-012/5X with alternatives
Compare MCP1811ATT-012/OT with alternatives