MCP16363T-E/NMX
vs
MCP16362T-E/NMXVAO
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Reach Compliance Code |
compliant
|
compliant
|
Factory Lead Time |
4 Weeks
|
|
Samacsys Manufacturer |
Microchip
|
|
Additional Feature |
ALSO HAS PFM CONTROL TECHNIQUE
|
ALSO HAS PFM CONTROL TECHNIQUE
|
Analog IC - Other Type |
SWITCHING REGULATOR
|
SWITCHING REGULATOR
|
Control Mode |
CURRENT-MODE
|
CURRENT-MODE
|
Control Technique |
PULSE WIDTH MODULATION
|
PULSE WIDTH MODULATION
|
Input Voltage-Max |
48 V
|
48 V
|
Input Voltage-Min |
4 V
|
4 V
|
Input Voltage-Nom |
12 V
|
12 V
|
JESD-30 Code |
S-PDSO-N8
|
S-PDSO-N8
|
Length |
3 mm
|
3 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Voltage-Max |
24 V
|
24 V
|
Output Voltage-Min |
2 V
|
2 V
|
Output Voltage-Nom |
3.3 V
|
3.3 V
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVSON
|
HVSON
|
Package Equivalence Code |
SOLCC8,.12,25
|
SOLCC8,.12,25
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
Seated Height-Max |
0.9 mm
|
0.9 mm
|
Supply Voltage-Nom (Vsup) |
12 V
|
|
Surface Mount |
YES
|
YES
|
Switcher Configuration |
BUCK
|
BUCK
|
Switching Frequency-Max |
2600 kHz
|
2600 kHz
|
Temperature Grade |
AUTOMOTIVE
|
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
3 mm
|
3 mm
|
Base Number Matches |
2
|
1
|
JESD-609 Code |
|
e3
|
Output Current-Max |
|
3 A
|
Screening Level |
|
AEC-Q100
|
Terminal Finish |
|
Matte Tin (Sn)
|
|
|
|
Compare MCP16363T-E/NMX with alternatives
Compare MCP16362T-E/NMXVAO with alternatives