MCP14A0153T-E/MS
vs
IXLD427MJA/BI
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
LITTELFUSE INC
|
| Package Description |
MSOP-8
|
DIP, DIP8,.3
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
21 Weeks
|
|
| Samacsys Manufacturer |
Microchip
|
|
| High Side Driver |
YES
|
|
| Input Characteristics |
SCHMITT TRIGGER
|
|
| Interface IC Type |
BUFFER OR INVERTER BASED MOSFET DRIVER
|
|
| JESD-30 Code |
S-PDSO-G8
|
R-XDIP-T8
|
| JESD-609 Code |
e3
|
e0
|
| Length |
3 mm
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
2
|
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Output Characteristics |
TOTEM-POLE
|
|
| Output Peak Current Limit-Nom |
1.5 A
|
|
| Output Polarity |
INVERTED
|
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC
|
| Package Code |
TSSOP
|
DIP
|
| Package Equivalence Code |
TSSOP8,.19
|
DIP8,.3
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Screening Level |
TS 16949
|
|
| Seated Height-Max |
1.1 mm
|
|
| Supply Current-Max |
1.6 mA
|
|
| Supply Voltage-Max |
18 V
|
|
| Supply Voltage-Min |
4.5 V
|
|
| Supply Voltage1-Max |
18 V
|
|
| Supply Voltage1-Min |
4.5 V
|
|
| Surface Mount |
YES
|
NO
|
| Temperature Grade |
AUTOMOTIVE
|
MILITARY
|
| Terminal Finish |
MATTE TIN
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
0.65 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Turn-off Time |
0.055 µs
|
|
| Turn-on Time |
0.055 µs
|
|
| Width |
3 mm
|
|
| Base Number Matches |
1
|
2
|
| Technology |
|
CMOS
|
|
|
|
Compare MCP14A0153T-E/MS with alternatives
Compare IXLD427MJA/BI with alternatives