MCM72F6ADG9
vs
CYM9260-66C
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA INC
|
CYPRESS SEMICONDUCTOR CORP
|
| Package Description |
DIMM-168
|
DIMM, DIMM168
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
9 ns
|
10.3 ns
|
| Additional Feature |
FLOW-THROUGH ARCHITECTURE
|
|
| I/O Type |
COMMON
|
COMMON
|
| JESD-30 Code |
R-XDMA-N168
|
R-XDMA-N168
|
| Memory Density |
4718592 bit
|
4718592 bit
|
| Memory IC Type |
SRAM MODULE
|
CACHE SRAM MODULE
|
| Memory Width |
72
|
72
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
168
|
168
|
| Number of Words |
65536 words
|
65536 words
|
| Number of Words Code |
64000
|
64000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
64KX72
|
64KX72
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
DIMM
|
DIMM
|
| Package Equivalence Code |
DIMM168
|
DIMM168
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
MICROELECTRONIC ASSEMBLY
|
MICROELECTRONIC ASSEMBLY
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Current-Max |
0.9 mA
|
1 mA
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.465 V
|
| Supply Voltage-Min (Vsup) |
3.135 V
|
3.135 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
BICMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
3
|
1
|
| Part Package Code |
|
DIMM
|
| Pin Count |
|
168
|
| JESD-609 Code |
|
e0
|
| Standby Voltage-Min |
|
3.14 V
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare MCM72F6ADG9 with alternatives
Compare CYM9260-66C with alternatives