MCM69L618ZP9.5R
vs
IBM0418A11NLAA-3F
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Contact Manufacturer
Ihs Manufacturer
MOTOROLA INC
IBM MICROELECTRONICS
Part Package Code
BGA
BGA
Package Description
BGA,
BGA,
Pin Count
119
119
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
9.5 ns
2 ns
JESD-30 Code
R-PBGA-B119
R-PBGA-B119
Length
22 mm
22 mm
Memory Density
1179648 bit
1179648 bit
Memory IC Type
CACHE SRAM
STANDARD SRAM
Memory Width
18
18
Number of Functions
1
1
Number of Ports
1
Number of Terminals
119
119
Number of Words
65536 words
65536 words
Number of Words Code
64000
64000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
Organization
64KX18
64KX18
Output Characteristics
3-STATE
Output Enable
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.4 mm
2.57 mm
Supply Voltage-Max (Vsup)
3.6 V
3.63 V
Supply Voltage-Min (Vsup)
3.15 V
3.135 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
BICMOS
CMOS
Temperature Grade
COMMERCIAL
OTHER
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
14 mm
14 mm
Base Number Matches
2
1
Additional Feature
PIPELINED ARCHITECTURE
Compare MCM69L618ZP9.5R with alternatives
Compare IBM0418A11NLAA-3F with alternatives