MCM6265CP12 vs EDI8833LP55CB feature comparison

MCM6265CP12 Motorola Mobility LLC

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EDI8833LP55CB Electronic Designs Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC ELECTRONIC DESIGNS INC
Part Package Code DIP
Package Description DIP, DIP28,.3
Pin Count 28
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8542.32.00.41
Access Time-Max 12 ns 55 ns
I/O Type COMMON COMMON
JESD-30 Code R-PDIP-T28 R-CDIP-T28
JESD-609 Code e0 e0
Length 34.67 mm
Memory Density 73728 bit 262144 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 9 8
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 28 28
Number of Words 8192 words 32768 words
Number of Words Code 8000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 8KX9 32KX8
Output Characteristics 3-STATE 3-STATE
Output Enable YES YES
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Equivalence Code DIP28,.3 DIP28,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.57 mm
Standby Current-Max 0.02 A 0.00035 A
Standby Voltage-Min 4.5 V 2 V
Supply Current-Max 0.15 mA 0.125 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 1 1
Rohs Code No
Screening Level 38535Q/M;38534H;883B

Compare MCM6265CP12 with alternatives

Compare EDI8833LP55CB with alternatives