MCM6265CP12
vs
EDI8G32512C15MMC
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA SEMICONDUCTOR PRODUCTS
WHITE ELECTRONIC DESIGNS CORP
Package Description
DIP, DIP28,.3
SIMM-72
Reach Compliance Code
unknown
unknown
Access Time-Max
12 ns
25 ns
I/O Type
COMMON
JESD-30 Code
R-PDIP-T28
R-XSMA-N72
JESD-609 Code
e0
Length
34.67 mm
Memory Density
73728 bit
16777216 bit
Memory IC Type
STANDARD SRAM
SRAM MODULE
Memory Width
9
32
Number of Functions
1
1
Number of Ports
1
Number of Terminals
28
72
Number of Words
8192 words
524288 words
Number of Words Code
8000
512000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
8KX9
512KX32
Output Characteristics
3-STATE
Output Enable
YES
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
DIP
SIMM
Package Equivalence Code
DIP28,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
MICROELECTRONIC ASSEMBLY
Parallel/Serial
PARALLEL
PARALLEL
Power Supplies
5 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.57 mm
Standby Current-Max
0.02 A
Standby Voltage-Min
4.5 V
Supply Current-Max
0.15 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
NO LEAD
Terminal Pitch
2.54 mm
Terminal Position
DUAL
SINGLE
Width
7.62 mm
Base Number Matches
3
1
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare MCM6265CP12 with alternatives
Compare EDI8G32512C15MMC with alternatives