MCM6164CC70
vs
MSM832TLMB-10
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
APTA GROUP INC
Part Package Code
DIP
DIP
Package Description
DIP, DIP28,.6
DIP, DIP28,.3
Pin Count
28
28
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
70 ns
100 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-CDIP-T28
R-CDIP-T28
JESD-609 Code
e0
Length
37.145 mm
35.56 mm
Memory Density
65536 bit
262144 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Ports
1
Number of Terminals
28
28
Number of Words
8192 words
32768 words
Number of Words Code
8000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Organization
8KX8
32KX8
Output Characteristics
3-STATE
3-STATE
Output Enable
YES
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Equivalence Code
DIP28,.6
DIP28,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.84 mm
4.3 mm
Standby Current-Max
0.001 A
0.00017 A
Standby Voltage-Min
4.5 V
2 V
Supply Current-Max
0.07 mA
0.07 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
7.62 mm
Base Number Matches
3
2
Screening Level
MIL-STD-883
Compare MCM6164CC70 with alternatives
Compare MSM832TLMB-10 with alternatives