MSM832TLMB-10
vs
W24258-70LE
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
APTA GROUP INC
WINBOND ELECTRONICS CORP
Part Package Code
DIP
DIP
Package Description
DIP, DIP28,.3
0.600 INCH, PLASTIC, DIP-28
Pin Count
28
28
Reach Compliance Code
unknown
not_compliant
ECCN Code
3A001.A.2.C
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
100 ns
100 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-CDIP-T28
R-PDIP-T28
Length
35.56 mm
37.08 mm
Memory Density
262144 bit
262144 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-20 °C
Organization
32KX8
32KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP28,.3
DIP28,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
Seated Height-Max
4.3 mm
5.33 mm
Standby Current-Max
0.00017 A
Standby Voltage-Min
2 V
2 V
Supply Current-Max
0.07 mA
0.07 mA
Supply Voltage-Max (Vsup)
5.5 V
3.3 V
Supply Voltage-Min (Vsup)
4.5 V
2.7 V
Supply Voltage-Nom (Vsup)
5 V
3 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
OTHER
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
15.24 mm
Base Number Matches
2
1
Rohs Code
JESD-609 Code
e0
Terminal Finish
TIN LEAD
Compare MSM832TLMB-10 with alternatives
Compare W24258-70LE with alternatives