MSM832TLMB-10 vs W24258-70LE feature comparison

MSM832TLMB-10 APTA Group Inc

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W24258-70LE Winbond Electronics Corp

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer APTA GROUP INC WINBOND ELECTRONICS CORP
Part Package Code DIP DIP
Package Description DIP, DIP28,.3 0.600 INCH, PLASTIC, DIP-28
Pin Count 28 28
Reach Compliance Code unknown not_compliant
ECCN Code 3A001.A.2.C EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 100 ns 100 ns
I/O Type COMMON COMMON
JESD-30 Code R-CDIP-T28 R-PDIP-T28
Length 35.56 mm 37.08 mm
Memory Density 262144 bit 262144 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -20 °C
Organization 32KX8 32KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP28,.3 DIP28,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883
Seated Height-Max 4.3 mm 5.33 mm
Standby Current-Max 0.00017 A
Standby Voltage-Min 2 V 2 V
Supply Current-Max 0.07 mA 0.07 mA
Supply Voltage-Max (Vsup) 5.5 V 3.3 V
Supply Voltage-Min (Vsup) 4.5 V 2.7 V
Supply Voltage-Nom (Vsup) 5 V 3 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY OTHER
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 15.24 mm
Base Number Matches 2 1
Rohs Code No
JESD-609 Code e0
Terminal Finish TIN LEAD

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Compare W24258-70LE with alternatives