MCIMX6X3EVK10AC
vs
MCIMX6L8DVN10AA
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
FREESCALE SEMICONDUCTOR INC
Package Description
MABGA-400
MAPBGA-432
Reach Compliance Code
compliant
compliant
ECCN Code
5A992.C
5A992
HTS Code
8542.31.00.01
8542.31.00.01
Factory Lead Time
2 Days
Samacsys Manufacturer
NXP
JESD-30 Code
S-PBGA-B400
S-PBGA-B432
JESD-609 Code
e1
e1
Length
14 mm
13 mm
Moisture Sensitivity Level
3
3
Number of Terminals
400
432
Operating Temperature-Max
105 °C
95 °C
Operating Temperature-Min
-20 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
TFBGA
Package Equivalence Code
BGA400,20X20,25
BGA432,24X24,20
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
260
Seated Height-Max
1.3 mm
1.1 mm
Supply Voltage-Max
1.5 V
1.5 V
Supply Voltage-Min
1.35 V
1.375 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
0.65 mm
0.5 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
40
Width
14 mm
13 mm
uPs/uCs/Peripheral ICs Type
SoC
SoC
Base Number Matches
1
2
Pbfree Code
Qualification Status
Not Qualified
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