MCIMX6X3EVK10AC
vs
MCIMX6U8DVM10AC
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
FREESCALE SEMICONDUCTOR INC
|
Package Description |
MABGA-400
|
21 X 21 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-2240
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
5A992.C
|
5A992
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Factory Lead Time |
2 Days
|
|
Samacsys Manufacturer |
NXP
|
|
JESD-30 Code |
S-PBGA-B400
|
S-PBGA-B2240
|
JESD-609 Code |
e1
|
e1
|
Length |
14 mm
|
21 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of Terminals |
400
|
2240
|
Operating Temperature-Max |
105 °C
|
|
Operating Temperature-Min |
-20 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFBGA
|
LFBGA
|
Package Equivalence Code |
BGA400,20X20,25
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
|
Seated Height-Max |
1.3 mm
|
1.5 mm
|
Supply Voltage-Max |
1.5 V
|
|
Supply Voltage-Min |
1.35 V
|
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.65 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Width |
14 mm
|
21 mm
|
uPs/uCs/Peripheral ICs Type |
SoC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
1
|
2
|
Pbfree Code |
|
Yes
|
Address Bus Width |
|
16
|
Boundary Scan |
|
YES
|
External Data Bus Width |
|
64
|
Format |
|
FIXED POINT
|
Integrated Cache |
|
YES
|
Low Power Mode |
|
YES
|
Speed |
|
1000 MHz
|
|
|
|
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