MCIMX27VOP4AR2
vs
MCIMX27VOP4R2
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Not Recommended
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
FREESCALE SEMICONDUCTOR INC
|
Package Description |
MABGA-404
|
LFBGA,
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
5A992.C
|
|
HTS Code |
8542.31.00.01
|
8542.39.00.01
|
Factory Lead Time |
18 Weeks
|
|
Samacsys Manufacturer |
NXP
|
|
Additional Feature |
ALSO OPERATES 1.3V AT 266MHZ
|
ALSO OPERATES 1.3V AT 266MHZ
|
JESD-30 Code |
S-PBGA-B404
|
S-PBGA-B404
|
JESD-609 Code |
e1
|
|
Length |
17 mm
|
17 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of Terminals |
404
|
404
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-20 °C
|
-20 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFBGA
|
LFBGA
|
Package Equivalence Code |
BGA404,24X24,25
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Seated Height-Max |
1.4 mm
|
1.4 mm
|
Supply Voltage-Max |
1.52 V
|
1.52 V
|
Supply Voltage-Min |
1.38 V
|
1.38 V
|
Supply Voltage-Nom |
1.45 V
|
1.45 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
COMMERCIAL EXTENDED
|
Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
TIN SILVER COPPER OVER NICKEL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
Width |
17 mm
|
17 mm
|
uPs/uCs/Peripheral ICs Type |
SoC
|
SoC
|
Base Number Matches |
2
|
1
|
Pbfree Code |
|
Yes
|
Part Package Code |
|
BGA
|
Pin Count |
|
404
|
Qualification Status |
|
Not Qualified
|
|
|
|
Compare MCIMX27VOP4AR2 with alternatives
Compare MCIMX27VOP4R2 with alternatives