MCIMX27MJP4A
vs
MPC8308CVMADDA
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Not Recommended
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
Package Description |
MAPBGA-473
|
MAPBGA-473
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
5A992.C
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Factory Lead Time |
4 Weeks
|
|
Samacsys Manufacturer |
NXP
|
NXP
|
Additional Feature |
ALSO OPERATES WITH 1.3VNOM @266MHZ
|
|
JESD-30 Code |
S-PBGA-B473
|
S-PBGA-B473
|
JESD-609 Code |
e1
|
e2
|
Length |
19 mm
|
19 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of Terminals |
473
|
473
|
Operating Temperature-Max |
85 °C
|
105 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFBGA
|
LFBGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.54 mm
|
1.54 mm
|
Supply Voltage-Max |
1.52 V
|
1.05 V
|
Supply Voltage-Min |
1.38 V
|
0.95 V
|
Supply Voltage-Nom |
1.45 V
|
1 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
Tin/Silver (Sn/Ag)
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
Width |
19 mm
|
19 mm
|
uPs/uCs/Peripheral ICs Type |
SoC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
2
|
1
|
Address Bus Width |
|
14
|
Boundary Scan |
|
YES
|
External Data Bus Width |
|
32
|
Format |
|
FLOATING POINT
|
Integrated Cache |
|
YES
|
Low Power Mode |
|
YES
|
Speed |
|
266 MHz
|
|
|
|
Compare MCIMX27MJP4A with alternatives
Compare MPC8308CVMADDA with alternatives