MCF5484CZP200
vs
XPC8240RZU250E
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
MOTOROLA INC
FREESCALE SEMICONDUCTOR INC
Part Package Code
BGA
BGA
Package Description
BGA, BGA388,26X26,40
LBGA, BGA352,26X26,50
Pin Count
388
352
Reach Compliance Code
unknown
not_compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
50 MHz
66 MHz
External Data Bus Width
32
32
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B388
S-PBGA-B352
Length
27 mm
35 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
1
3
Number of Terminals
388
352
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LBGA
Package Equivalence Code
BGA388,26X26,40
BGA352,26X26,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY, LOW PROFILE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.55 mm
1.65 mm
Speed
200 MHz
250 MHz
Supply Voltage-Max
1.58 V
2.625 V
Supply Voltage-Min
1.43 V
2.375 V
Supply Voltage-Nom
1.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
27 mm
35 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
4
5
Pbfree Code
Additional Feature
ALSO REQUIRES 3.3V I/O SUPPLY
JESD-609 Code
e0
Peak Reflow Temperature (Cel)
220
Terminal Finish
Tin/Lead/Silver (Sn/Pb/Ag)
Time@Peak Reflow Temperature-Max (s)
30
Compare MCF5484CZP200 with alternatives
Compare XPC8240RZU250E with alternatives