MCF5475ZP266 vs MCF5474VR266 feature comparison

MCF5475ZP266 Motorola Mobility LLC

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MCF5474VR266 Freescale Semiconductor

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MOTOROLA INC FREESCALE SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description BGA, BGA388,26X26,40 TEPBGA-388
Pin Count 388 388
Reach Compliance Code unknown compliant
ECCN Code 3A991.A.2 5A992
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 66.66 MHz 66.67 MHz
External Data Bus Width 32 32
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B388 S-PBGA-B388
Length 27 mm 27 mm
Low Power Mode YES YES
Number of Terminals 388 388
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA388,26X26,40 BGA388,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.55 mm 2.55 mm
Speed 266.66 MHz 266.66 MHz
Supply Voltage-Max 1.58 V 1.58 V
Supply Voltage-Min 1.43 V 1.43 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 27 mm 27 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
Samacsys Manufacturer NXP
JESD-609 Code e1
Moisture Sensitivity Level 3
Number of DMA Channels 16
Number of Serial I/Os 4
On Chip Data RAM Width 8
Peak Reflow Temperature (Cel) 260
RAM (words) 32768
Terminal Finish TIN SILVER COPPER
Time@Peak Reflow Temperature-Max (s) 40

Compare MCF5475ZP266 with alternatives

Compare MCF5474VR266 with alternatives