MCF5474VR266
vs
MCF5472VR200
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
ROCHESTER ELECTRONICS LLC
Part Package Code
BGA
BGA
Package Description
TEPBGA-388
27 X 27 MM, MS-034AAL-1, PBGA-388
Pin Count
388
388
Reach Compliance Code
compliant
unknown
ECCN Code
5A992
HTS Code
8542.31.00.01
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
66.67 MHz
66.66 MHz
External Data Bus Width
32
32
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B388
S-PBGA-B388
JESD-609 Code
e1
e1
Length
27 mm
27 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
3
3
Number of DMA Channels
16
Number of Serial I/Os
4
Number of Terminals
388
388
On Chip Data RAM Width
8
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA388,26X26,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
COMMERCIAL
RAM (words)
32768
Seated Height-Max
2.55 mm
2.55 mm
Speed
266.66 MHz
200 MHz
Supply Voltage-Max
1.58 V
1.58 V
Supply Voltage-Min
1.43 V
1.43 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN SILVER COPPER
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
40
Width
27 mm
27 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR, RISC
Base Number Matches
3
3
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