MCF5470ZP200
vs
XPC8240LZU200LC
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
MOTOROLA INC
Part Package Code
BGA
Package Description
27 X 27 MM, MS-034AAL-1, PBGA-388
LBGA,
Pin Count
388
Reach Compliance Code
not_compliant
unknown
ECCN Code
5A992
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
66.66 MHz
66 MHz
External Data Bus Width
32
32
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B388
S-PBGA-B352
JESD-609 Code
e0
Length
27 mm
35 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
3
Number of Terminals
388
352
Operating Temperature-Max
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LBGA
Package Equivalence Code
BGA388,26X26,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.55 mm
1.65 mm
Speed
200 MHz
200 MHz
Supply Voltage-Max
1.58 V
2.625 V
Supply Voltage-Min
1.43 V
2.375 V
Supply Voltage-Nom
1.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
Terminal Finish
Tin/Lead/Silver (Sn/Pb/Ag)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
Width
27 mm
35 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
3
2
Compare MCF5470ZP200 with alternatives
Compare XPC8240LZU200LC with alternatives