MCF5470ZP200
vs
MPC8240LZU200X
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
MOTOROLA INC
NXP SEMICONDUCTORS
Package Description
27 X 27 MM, 1 MM PITCH, PLASTIC, MS-034AAL-1, BGA-388
LBGA,
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
66.66 MHz
External Data Bus Width
32
64
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B388
S-PBGA-B352
Length
27 mm
35 mm
Low Power Mode
YES
YES
Number of Terminals
388
352
Operating Temperature-Max
70 °C
105 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LBGA
Package Equivalence Code
BGA388,26X26,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY, LOW PROFILE
Qualification Status
Not Qualified
Seated Height-Max
2.55 mm
1.65 mm
Speed
200 MHz
200 MHz
Supply Voltage-Max
1.58 V
2.625 V
Supply Voltage-Min
1.43 V
2.375 V
Supply Voltage-Nom
1.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
OTHER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
27 mm
35 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
3
4