MCF54410CMF250
vs
GD80960JA-25
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
INTEL CORP
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
12 X 12 MM, ROHS COMPLIANT, MAPBGA-196
|
BGA, BGA196(UNSPEC)
|
| Pin Count |
196
|
196
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
3A991
|
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
|
32
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
100 MHz
|
25 MHz
|
| External Data Bus Width |
|
32
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Integrated Cache |
YES
|
NO
|
| JESD-30 Code |
S-PBGA-B196
|
S-PBGA-B196
|
| Low Power Mode |
YES
|
YES
|
| Number of Terminals |
196
|
196
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA196,14X14,40
|
BGA196(UNSPEC)
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Speed |
250 MHz
|
25 MHz
|
| Supply Voltage-Max |
1.32 V
|
3.45 V
|
| Supply Voltage-Min |
1.14 V
|
3.15 V
|
| Supply Voltage-Nom |
1.2 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
2
|
1
|
| Additional Feature |
|
BURST BUS
|
| Supply Current-Max |
|
260 mA
|
|
|
|
Compare MCF54410CMF250 with alternatives
Compare GD80960JA-25 with alternatives