MCF5272CVF66
vs
GD80960JD50
feature comparison
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
MOTOROLA INC
|
INTEL CORP
|
Part Package Code |
BGA
|
BGA
|
Package Description |
BGA, BGA196,14X14,40
|
BGA, BGA196(UNSPEC)
|
Pin Count |
196
|
196
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
3A991.A.2
|
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
23
|
32
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
66 MHz
|
25 MHz
|
External Data Bus Width |
32
|
32
|
Format |
FIXED POINT
|
FIXED POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-PBGA-B196
|
S-PBGA-B196
|
Length |
15 mm
|
|
Low Power Mode |
YES
|
YES
|
Number of Terminals |
196
|
196
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA196,14X14,40
|
BGA196(UNSPEC)
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.75 mm
|
|
Speed |
66 MHz
|
50 MHz
|
Supply Voltage-Max |
3.6 V
|
3.45 V
|
Supply Voltage-Min |
3 V
|
3.15 V
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
15 mm
|
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
5
|
1
|
Supply Current-Max |
|
447 mA
|
|
|
|
Compare MCF5272CVF66 with alternatives
Compare GD80960JD50 with alternatives