MCF5272CVF66
vs
MC68SZ328VH66V
feature comparison
All Stats
Differences Only
Pbfree Code
No
Rohs Code
No
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
FREESCALE SEMICONDUCTOR INC
Part Package Code
BGA
BGA
Package Description
PLASTIC, BGA-196
12 X 12 MM, 0.80 MM PITCH, MAPBGA-196
Pin Count
196
196
Reach Compliance Code
not_compliant
unknown
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
23
25
Bit Size
32
Boundary Scan
YES
NO
Clock Frequency-Max
66 MHz
16 MHz
External Data Bus Width
32
16
Format
FIXED POINT
FIXED POINT
Integrated Cache
YES
NO
JESD-30 Code
S-PBGA-B196
S-PBGA-B196
JESD-609 Code
e0
Length
15 mm
12 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
3
Number of Terminals
196
196
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LFBGA
Package Equivalence Code
BGA196,14X14,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
220
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
1.36 mm
Speed
66 MHz
66.32 MHz
Supply Voltage-Max
3.6 V
3.3 V
Supply Voltage-Min
3 V
2.7 V
Supply Voltage-Nom
3.3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
HCMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
Tin/Lead/Silver (Sn/Pb/Ag)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
15 mm
12 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR
Base Number Matches
1
1
Compare MCF5272CVF66 with alternatives
Compare MC68SZ328VH66V with alternatives