MCF5272CVF66 vs GD80960JA-25 feature comparison

MCF5272CVF66 Freescale Semiconductor

Buy Now Datasheet

GD80960JA-25 Intel Corporation

Buy Now Datasheet
Pbfree Code No
Rohs Code No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC INTEL CORP
Part Package Code BGA BGA
Package Description PLASTIC, BGA-196 BGA, BGA196(UNSPEC)
Pin Count 196 196
Reach Compliance Code not_compliant compliant
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer NXP
Address Bus Width 23 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 66 MHz 25 MHz
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
Integrated Cache YES NO
JESD-30 Code S-PBGA-B196 S-PBGA-B196
JESD-609 Code e0
Length 15 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3
Number of Terminals 196 196
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA196,14X14,40 BGA196(UNSPEC)
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 220
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm
Speed 66 MHz 25 MHz
Supply Voltage-Max 3.6 V 3.45 V
Supply Voltage-Min 3 V 3.15 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Lead/Silver (Sn/Pb/Ag)
Terminal Form BALL BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 15 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1
Additional Feature BURST BUS
Supply Current-Max 260 mA

Compare MCF5272CVF66 with alternatives

Compare GD80960JA-25 with alternatives