MCF5270AB100
vs
TMP68204F-16
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
TOSHIBA CORP
|
| Part Package Code |
QFP
|
|
| Package Description |
ROHS COMPLIANT, PLASTIC, QFP-160
|
QFP,
|
| Pin Count |
160
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
5A992
|
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Samacsys Manufacturer |
NXP
|
|
| Additional Feature |
ALSO REQUIRES 3.3V SUPPLY
|
|
| Address Bus Width |
24
|
|
| Bit Size |
32
|
|
| Boundary Scan |
YES
|
|
| Clock Frequency-Max |
75 MHz
|
|
| External Data Bus Width |
32
|
|
| Format |
FIXED POINT
|
|
| Integrated Cache |
YES
|
|
| JESD-30 Code |
S-PQFP-G160
|
S-PQFP-G160
|
| JESD-609 Code |
e3
|
|
| Length |
28 mm
|
28 mm
|
| Low Power Mode |
YES
|
|
| Moisture Sensitivity Level |
3
|
|
| Number of Terminals |
160
|
160
|
| Operating Temperature-Max |
70 °C
|
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QFP
|
QFP
|
| Package Equivalence Code |
QFP160,1.2SQ
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK
|
FLATPACK
|
| Peak Reflow Temperature (Cel) |
245
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.85 mm
|
4.45 mm
|
| Speed |
100 MHz
|
|
| Supply Voltage-Max |
1.6 V
|
|
| Supply Voltage-Min |
1.4 V
|
|
| Supply Voltage-Nom |
1.5 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
28 mm
|
28 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare MCF5270AB100 with alternatives
Compare TMP68204F-16 with alternatives